Copper plating bath offer a number of desirable features. Copper plating with pyrophosphate plating has good throwing power, is noncorrosive and non toxic.
Because of these advantages, copper pyrophosphate solutions are widely utilized. The most common use is in the fabrication of through hole printed wiring boards by the electronics industry. Because of its importance and the special problem associated with it, this process is described in detail in other title.
The production of electroforms for objects such as waveguides, paint spray masks, helical antenna, heat exchangers, and aluminum parts, plastics having a conductive surface, and zinc die castings before bright nickel and chromium plating. Miscellaneous applications include use as a lubricant for wire deep-drawing operations, as a stopoff on steel for selective hardening operation such as nitriding and carburizing in roll plating and in minimizing hydrogen embritlement.
Copper pyrophosphate plating bath contains copper pyrophosphate (Cu2P2O7.3H2O), either potassium pyrophosphate (K4P2)O7), nitrate (NO3-), and ammonia (NH3).
The pyrophosphate salts react in aqueous solution to form alkaline complex anions, the major complex Cu(P2O7)26- and also (CuP2O7)2-. The solution is of intermediate stability.
Because of these advantages, copper pyrophosphate solutions are widely utilized. The most common use is in the fabrication of through hole printed wiring boards by the electronics industry. Because of its importance and the special problem associated with it, this process is described in detail in other title.
The production of electroforms for objects such as waveguides, paint spray masks, helical antenna, heat exchangers, and aluminum parts, plastics having a conductive surface, and zinc die castings before bright nickel and chromium plating. Miscellaneous applications include use as a lubricant for wire deep-drawing operations, as a stopoff on steel for selective hardening operation such as nitriding and carburizing in roll plating and in minimizing hydrogen embritlement.
Copper pyrophosphate plating bath contains copper pyrophosphate (Cu2P2O7.3H2O), either potassium pyrophosphate (K4P2)O7), nitrate (NO3-), and ammonia (NH3).
The pyrophosphate salts react in aqueous solution to form alkaline complex anions, the major complex Cu(P2O7)26- and also (CuP2O7)2-. The solution is of intermediate stability.